Hybrid Memory Cube is an innovation in DRAM memory that promises a new standard for reduced cost, memory performance, and lowered power consumption. HMC uses 3D packaging of multiple memory dies, typically four or eight, along with through-silicon vias (TSV) and microbumps. The result is more data banks than classic DRAM memory of the same size. In addition, the memory controller is integrated in a memory package as a separate logic die.
Each HMC package is called a cube. Cubes can be chained in networks of up to eight cubes with cube-to-cube links, some of which are pass-through links. A typical cube package with four links has 896 BGA pins and is 31 x 31 x 3.8 millimeters.
How fast should HMC be? The typical raw bandwidth of a single 16-lane link with 10 Gbps signalling is 40 GB/s (20 GB/s transmit and 20 GB/s receive).CURTIS FRANKLIN JR.
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